Products overview
Thermal AWG module offers accurate channel and high reliability base on the silica which is from silicon technology and complemented with automated and robust packaging.
Features
● MUX/DEMUX functionality
● Multi-channel number
● Low insertion Loss, Low PDL
● High Chanel Isolation
● Qualified under Telcordia 1209/1221 and RoHS Compliant
AWG Specification
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